[HN Gopher] Universal Chiplet Interconnect Express UCIe 1.0 Laun... ___________________________________________________________________ Universal Chiplet Interconnect Express UCIe 1.0 Launched Author : ksec Score : 41 points Date : 2022-03-03 09:05 UTC (13 hours ago) (HTM) web link (www.servethehome.com) (TXT) w3m dump (www.servethehome.com) | [deleted] | MBCook wrote: | While not mentioned in the article, and also obviously not using | the new standard, Apple has been putting multiple dies on a | single package too lately haven't they? Isn't that how RAM is | done on the various M-series chips? | neogodless wrote: | > putting multiple dies on a single package | | This part isn't new, or why this is significant. For example, | AMD has been doing this since Zen 2 (Ryzen 2xxx), combining | 14nm and 7nm components. | | On the other hand, the top chip designers and foundries working | together and standardizing is potentially very significant, | though I reserve judgement until actual products are produced | on this new standard. | ksec wrote: | They are not. It is the same as how you normally put the DRAM | together just inside the same package. It is called System in | Package. The same way as Apple has done for their Apple Sx Chip | on Apple Watch for years. ___________________________________________________________________ (page generated 2022-03-03 23:00 UTC)